SAGE

Quality Control and Characterization Test Services

Quality Control and Characterization Test Request

To create a Quality Control and Characterization Test Request, please go to the relevant page and fill out the form.
Quality Control and Characterization Tests are carried out to determine some physical, chemical, mechanical and functional properties of materials/products used for military and civilian purposes.

Non Destructive Quality Control Laboratory

The Nondestructive Quality Control Laboratory serves under the Quality Control Group. This unit employs 3 engineers, 3 technicians and 2 craftsmen certified according to EN ISO 9712. Radiographic, ultrasonic, magnetic particle, liquid penetrant and visual inspection tests can be performed in our unit as non-destructive testing methods. Information about the devices used in these methods and the capacities of the devices are given below:

Radiographic Inspection Capabilities

X-Ray System (Y. Access 100 X-Ray System)

The system has a minifocus tube with 450 kilovolt capacity and a 14-bit flat panel detector. It has the ability to move in an area of approximately 4.5×9 square meters. Thanks to the sample bench specially produced for the device, X-Ray Tests can be performed on samples up to 1,000 mm in diameter and 8,000 mm in length.

X-Ray Tomography System (Y.CT Modular X-Ray System)

The system has a 225 kilovolt microfocus tube, a 450 kilovolt minifocus tube and a 16-bit flat panel detector. It can capture images up to 320 mm in diameter, 500 mm in length and 50 kg in weight. The penetration limit of this device is 65 mm steel equivalent thickness. Defect analysis, thickness analysis, dimensional measurement and actual-nominal condition comparison can be performed on parts that can be tomographed.

X-Ray Systems for Electronic Boards

Y. Cougar SMT X-Ray System

The system has a 160 kilovolt microfocus tube and a 14-bit flat panel detector. It is used for the inspection of electronic boards and components.

Y. Cheetah SMT X-Ray System

The system has a 160 kilovolt microfocus tube and a 16-bit flat panel detector. It is used for the inspection of electronic cards and components. Laminography and tomography applications can also be performed with this system.

Y. Cougar EVO X-Ray System

The system has a 160 kilovolt microfocus tube and a 14-bit flat panel detector. It is used for the inspection of electronic cards and components. In addition, tomography applications can be performed with this system.

Comet Evo Portable X-Ray System

The system has a minifocus tube with 300 kilovolt capacity and a 16-bit flat panel detector. It is used for X-ray photography in field applications.

Ultrasonic Test Capabilities

Ultrasonic inspection is a bulk inspection technique which is preferred for the detection of internal imperfections that cannot be observed with radiography. Two conventional ultrasonic test equipment, (EPOCH 4PLUS, GE USM GO) and one phased array ultrasonic test equipment (Olympus OmniScan MX2) are available in non-destructive testing quality control laboratory.

Magnetic Particle Testing Capabilities

It is used for the control of surface and subsurface discontinuities of ferromagnetic materials. Tests can be performed in daylight or under UV light. In our unit, there is one AC&DC hand magnet, one AC hand magnet and one MP 2500 AC_FWDC Magnetic Particle Crack Checker with operating voltage AC 230V and frequency 50Hz. With this device, surface and subsurface discontinuities of all ferromagnetic materials up to 2.500 mm in length and 500 mm in diameter can be controlled.

Liquid Penetrant Testing Capabilities

This inspection method is used to detect discontinuities open to the surface. In order to perform the test, the surface must be cleaned from all external elements such as oil, dirt, etc. and must be uncoated. The test can be performed in daylight or under UV light.

Visual Inspection Test Capabilities

With this inspection method, trained and certified personnel examine and evaluate surface defects. Lighting and measuring instruments (flashlight, caliper, lens, etc.) are used in this method. In addition, a videoscope device (GE Mentor Visual IQ VideoProbe) with a 6 mm diameter and 2 meter long motion-controlled fiberoptic cable is used to examine hard-to-reach areas and to make some measurements.

Material Quality Control Laboratory

In order for the parts used in the defense industry to meet the requirements determined for the design and working conditions, it is important that the material from which the part is produced meets the technical requirements. Whether the starting material meets the requirements is checked by determining the physical, chemical and mechanical properties of the material.

Mechanical properties can be defined as the resistance to shape change and fracture (rupture) of a material to which a load is applied. In the Material Quality Control Laboratory, properties such as elastic modulus, yield strength, tensile strength, elongation values in the elastic and plastic region are determined by experimental methods.

Static Tensile Compression Test Machine

There are 2 Instron brand 5982 model static test systems with floor seating in the infrastructure. With various load cells with 1 kN, 10 kN and 100 kN capacities, these devices provide the opportunity to perform a wide range of tests from elastomers that break at low loads to materials that break at the upper limit of the device. Holders, extension apparatus, adapters and strain gauges (video extensometer and mechanical strain gauge) used during the tests are available in the laboratory inventory.

Some features of the device are given below:

  • Load cells with 1 kN, 10 kN, 100 kN capacity provide a wide range of test possibilities.
  • The air conditioning cabinet is capable of operating in a temperature range of -75°C to +180°C.
  • The use of 8 mm and 16 mm focal length video extensometers and 25/50 mm focal length dynamic extensometers provides more reliable test results.

Fatigue Test Machine

Fatigue is a type of time-dependent fracture of structural parts that occurs under continuously changing dynamic load. The most familiar examples exposed to this effect are bridges, airplanes and moving machine parts. In structures subjected to fatigue, fracture occurs when the repetitive dynamic stress starts with a small crack, this crack progresses over time and the structure loses its integrity. This situation, which does not give prior warning and occurs suddenly, is considered as a catastrophic phenomenon in the literature.

With the Instron brand E10000 type fatigue tester installed in the Materials Quality Control Laboratory, both dynamic and static tests can be performed on many different types of materials and components. Some of the features of the device are given below:

  • Oil-free linear motor technology ensures a clean test environment.
  • It allows testing up to a frequency of 100 Hz as far as technical conditions (force-displacement) allow.
  • The device has a linear dynamic load capacity of ±10 kN and a dynamic torque capacity of ±100 Nm.

Air Conditioning Cabinet

The conditioning of the test specimens under the conditions specified by the test requirements is carried out by means of air conditioning cabinets. There are 4 air conditioning cabinets in the laboratory. 3 of them are integrated with the test device and one of them is used independently. The test temperatures reached in the air conditioning cabinets range from -75°C to +180°C.

Rockwell Hardness Tester

One of the tests applied to metallic materials, especially heat-treated materials, is Rockwell hardness measurement. Hardness measurement is a basic test that provides information about tensile strength, wear resistance, ductility, toughness and other physical properties in metallic materials. It is a measurement method frequently used in quality control and material selection.

Shore Hardness Tester (Durometer)

One of the methods used in hardness measurements of plastic, elastomer, polymer type materials is Shore hardness measurement. Using the load applied on the device and various variations of the measuring tip, measurements are performed on A, B, C, D, DO, E, M, O, OO, OOO, OOO-S, R scales.

Optical Emission Spectral Analyzer

Optical Emission Spectral Analyzer operating in argon gas environment is used to determine the chemical composition of metallic materials. The analysis is carried out by examining the spectrum of electrons excited from low energy level to high energy level as they return to their old place after losing their energy.

X-Ray Fluorescence (XRF) Analyzer

Primary X-rays are sent from an X-ray source onto the sample to be examined, and the rays hitting the sample eject electrons from the orbital closest to the atomic nucleus. Secondary X-rays, which are emitted by electrons in the outer orbitals in order to stabilize while filling the vacated space, are characteristic for each element and the rays at the energy level with this characteristic are called characteristic X-rays. By collecting these rays in a detector and then analyzing them, the chemical content of the sample is determined. XRF analysis has a wide measurement range from Na-U within the elements defined in the periodic table.

Conductivity Meter

Electrical conductivity is a distinctive material property. Conductivity measurements by eddy current technique are used to determine the heat treatment conditions of non-ferrous metals and aluminum materials. The unit of conductivity is megasiemens/meter (MS/m) and the unit of measurement used in direct reading meters is usually given as IACS (International Annealed Copper Standard).

Dimensional Quality Control Laboratory

In the Dimensional Quality Control Laboratory, dimensional quality control activities are carried out for the parts and components produced within the scope of projects, from raw material to the finished end product. Especially for precise measurements, dimensional quality control activities are carried out in a controlled laboratory environment.

Within the scope of dimensional quality control, complex parts are measured with CMM (Coordinate Measuring Machine), optical scanning and profile projection devices. In addition, ultrasonic thickness, coating and paint thickness measurements, surface roughness measurements, thread checks and measurements are performed with conventional quality control devices.

Geometric and Form Measurements

The form characteristics of the products assembled together are of utmost importance. Form error is defined as the deviation of the shape of the product from the relevant geometric shape.

Circularity and Form Measurement Capabilities

  • Form measurements can be made at the following accuracies:
    • Circularity Uncertainty: (0.02 + 0.0005) µm
    • Cylindricity Uncertainty: 0.15 µm (at 100 mm)
    • Sensitivity to runout, coaxiality, perpendicularity, parallelism (at 100 mm): 0.4 µm
  • Measuring Part Limitations:
    • Part Length (Maximum): 470 mm
    • Part Weight (Maximum): 60 kg
    • Inside Diameter (Maximum): Ø364 mm
    • Outer Diameter (Maximum): Ø280 mm

Form Contour Measurement Capabilities

It is mainly used for industrial applications and is used to determine the dimensions, shapes and geometric details of objects. Measurement can be made with an uncertainty of ±(0.25 + H/250) µm for radius, chamfer, step etc. forms larger than 0.05 mm:

  • Part Length (Minimum): 0.01 mm
  • Part Length (Maximum): 140 mm
  • Part Weight (Maximum): 90 kg
  • Inner Diameter Scan Length: Minimum Ø3 mm

Precise Dimension Measurement Capabilities

Measurement Capacities
  • High Precision Dimensional Measurements
    • Measurement can be made with an uncertainty of ±0.09 L / 2000 µm in inner and outer diameters.
    • Outside diameter measurement capacity: 0 to 300 mm
    • Inner diameter measurement capacity: 5 to 150 mm
    • Part weight (maximum): 11 kg
Coordinate Measurement System
  • Measurement According to Cartesian Coordinate
    • The head of the system, which moves in X, Y and Z axis, rotates 360 degrees on its own axis and offers versatile measurement.
    • Software used: Camio and PC-DMIS
    • Technical competencies and capabilities such as technical training, part program software, program accuracy checks are available.
Device Measurement
  • Uncertainty: 0.5 + L/500 µm (Minimum)
  • Measurement Capacities on Different Axes
    • X axis 700 mm (minimum), 1500 mm (maximum)
    • Y axis 1000 mm (minimum), 3300 mm (maximum)
    • Z axis: 650 mm (minimum), 1350 mm (maximum)
  • Device Measurement Volume
    • 700x1000x700 mm and 900x1500x800 mm
Software and Components
  • Software Used
    • Pc-Dmis CAD++
    • GOM Inspect Professional
    • Geomagic Control X
  • Components Required for Dimensional Measurement Studies
    • Components such as probes, extensions, apparatus are available in the infrastructure.
Laboratory Equipment and Systems
  • Dimensional Quality Control Laboratory
    • ATOS II, AICON Smart Scan, Breuckmann OPTO-TOP optical scanning systems
    • AICON DPI Pro (Photogrammetry) system
Surface Roughness and Physical Properties
  • Surface Roughness
    • Output is provided at the value of all surface parameters (Ra, Rq, Ry, Rz, etc.).
    • Measurement range: ±250 µm (up to ±750 µm with 3 x probe arm length)
    • Profile resolution:
      • Measuring range ± 250 µm: 8 nm
      • Measuring range ± 25 µm: 0.8 nm
      • Measuring range ± 500 µm: 16 nm
  • Inside Diameter Profile Surface Measurement Capacity
    • Min Ø25 mm diameter up to 125 mm depth
    • Min Ø5 mm diameter up to 75 mm depth
Measuring Instruments Used
  • Surface Roughness Measuring Instrument
    • MITUTOYO surface roughness measuring instrument
  • Ultrasonic Thickness Gauge
    • OLYMPUS ultrasonic thickness gauge
  • Traditional Quality Control Devices
    • Requested dimensional measurements can be made.

Chemical Quality Control Laboratory

The Chemical Quality Control Laboratory is an infrastructure that operates under the Quality Control Unit at TÜBİTAK SAGE and meets the characterization and quality control testing needs of fuels, explosives, pyrotechnics, insulation, composites and different types of polymeric materials used or produced within the Institute. Since 2008, testing and analysis services have also been provided for requests from outside the Institute within the scope of industrial services.

Studies are carried out in the Chemical Quality Control Laboratory with 2 researchers and 3 technicians. Information about the devices in our laboratory and the studies carried out with these devices are given below. Detailed information about the devices is also given in a table. Information about the analyzes performed other than instrumental analyzes is also given in a separate table.

Dynamic Mechanical Analysis (DMA)

DMA is a device used to determine the mechanical properties of materials by changing their temperature and frequency characteristics. It works with materials such as films, solid polymers, foams and composites. The DMA device is used to determine the glass transition temperature (Tg) and to study the viscoelastic properties of materials with appropriate apparatus (clamps). Single-dual cantilever, single-dual cantilever, 3-point bending, compression, tensile and film heads are often used with the DMA machine. Available clamps are also included in the specifications of the device. Time-temperature superposition (TTS) analyses are also performed with the DMA device. With these analyzes, aging/life information about materials is obtained.

Situations where TTS work cannot be carried out are as follows:

  • Samples with crystalline structure. Cases of partial melting in the temperature range to be studied.
  • Changes in the structure of the sample with temperature.
  • The sample is a block copolymer.
  • The sample is composed of polymers with different structures.
  • Different viscoelastic mechanisms other than configurational changes in the polymer (such as side-group movements).

High Performance Liquid Chromatography (HPLC) Analysis

High-performance liquid chromatography (HPLC) is an analysis method for highly sensitive content determinations at concentration levels of one part per million or one part per billion. Both qualitative and quantitative analyses are possible with HPLC analysis. For both analysis methods, the instrument must be calibrated using a reference chemical. In order to make the desired content determination, the suitability of the column and detectors in the HPLC instrument configuration and the compatibility of the sample with the column should be checked.

Thermal Analysis

Differential Scanning Calorimeter (DSC) Device

The DSC instrument is used to perform analyses that examine the temperature-dependent changes in the physical and molecular structure of the material. The main properties studied with this device are as follows:

  • Glass Transition Temperature (Tg): The temperature at which the material transitions to the glassy state.
  • Melting Temperature (Tm): Melting temperature of the material.
  • Crystallization Temperature (Tc): The temperature at which the material transitions to the crystalline state.
  • Decomposition Temperature (Td): The temperature at which the material starts to degrade.
  • Thermal Stability and Oxidation Stability: Thermal and oxidative resistance properties of the material.
  • Heat Capacity (Cp): Thermal capacity of the material.
  • Curing Time: Curing time of the material.

Analyzes are performed in nitrogen, argon or oxygen environment. Before the study, the decomposition temperature of the sample is determined in the thermogravimetric analyzer and the analysis is carried out in a way to stay below this temperature. Considering the behavior of the sample during and after combustion and the damage it may cause to the device chamber and the device, it is determined whether DSC analysis can be performed.

Thermogravimetric Analysis (TGA) Device

Thermogravimetric Analysis (TGA) is used to study the weight changes of materials against temperature. This device works by holding the materials at a certain temperature for a certain period of time or by heating-cooling at different scan rates to determine the weight changes and decomposition temperatures of the materials. Depending on the model of the TGA instrument, the operating range can be selected between room temperature and 1,000°C or 1,500°C.

During these analyzes, different ambient gases (oxygen, nitrogen, argon, etc.) can be used according to the analysis needs. By using kinetic models suitable for the material, the desired kinetic calculations and aging profiles can be obtained. It can be analyzed whether two or three materials are compatible with each other.

The Chemical Quality Control Laboratory has two TGA devices, one with a vertical oven (RT-1,000°C) and one with a horizontal oven (RT-1,500°C). Differential Thermal Analysis (DTA) can also be performed simultaneously with the horizontal oven device.

FTIR Analyzer

Fourier Transform Infrared Spectrometry (FTIR) is used to obtain information about the chemical bonding of materials. This device is used in analyses such as molecular bond characterization of materials, detection of functional groups, material comparisons, the state of bonds in the material structure and the detection of structural differences. The FTIR device in our laboratory operates in the 400-4,000 cm-1 range and has diamond-ATR (Attenuated Total Reflectance) and Ge-ATR modules. Thanks to these modules, FTIR analysis of materials can be performed directly without the need for KBr pellets.

Moisture Analysis

A reference method, Karl Fischer titration, is used to determine the moisture content of materials. Moisture analysis can be performed titrimetrically (volumetrically) for materials with high water content (% 5 and above) and coulometrically for materials containing less than one part per million (ppm) moisture (1 ppm - % 5). In addition, moisture analysis of solid materials can be performed quickly with an autosampler and an oven unit that can reach up to 280 °C.

Density Measurements

In our laboratory, true density measurements of solid and gel materials that will not damage the sample container are performed using a helium pycnometer. In addition, tap density and bulk density measurements are also performed for powdered materials. Images of the related devices are given below.

Stojan Vessel Burning Rate Tester**

Stojan Vessel Combustion Rate Tester is a device used to determine the combustion rates of solid fuels. Unlike devices working with the Strand burner principle, it allows the calculation of combustion rates between 0-500 bar by collecting data at all pressure values against time for fuels conditioned at a certain temperature. The SV combustion rate device can also be used as a closed bomb to measure the pressure value during combustion between 0-500 bar.

Test specimens are conditioned and tested between -70 and +180°C. For specimens conditioned below room temperature, X-ray analysis is also requested and if no deformation is observed after this analysis, the test is continued. For occupational safety reasons, it is mandatory to provide detailed information about the properties of the test samples before the test application and to make an assessment by our infrastructure on whether it is safe to work with the SV device. After this evaluation, the test procedures will be started. It will be the responsibility of the company requesting the test to cover any damage caused by the sample during the test.

The desired test dimensions of solid fuel samples are given below:

  • The thickness (e0) of the disk type specimen should be 10 mm ± 5 mm and the length should be 60 mm ± 20 mm.
  • The thickness (e0) of the tube type specimen should be 10 mm ± 5 mm, diameter 30 mm ± 10 mm and length < 10x (diameter-2x thickness).

Calorific Value Tester (Oxygen Bomb)

Calorific Value Tester is a device used to determine the amount of energy released by the combustion of energetic materials. This calorimeter is electrically ignited in a water chamber containing pure water of constant weight and temperature in a closed bomb system, causing the sample to burn. The energy released at the end of combustion is measured in cal/g or j/g and this value is determined at the end of the test.

Tests are usually carried out in nitrogen, argon or oxygen. For tests to be carried out in an oxygen environment, a pre-assessment by the laboratory in terms of occupational safety is mandatory. This assessment is important to ensure that the tests are carried out safely.

Impact Sensitivity Test

The impact sensitivity test is performed to determine the response of energetic materials to impact. The BAM (Bundesanstalt für Materialforschung und -prüfung) method is applied in this test. The test examines whether the material reacts, degrades or explodes. The application procedure of the test is as follows:

  • Specified weights (1, 2 and 5 kg) are dropped on the sample from a specified standard height (maximum 100 cm).
  • The reaction of the specimen is observed. The specimen is considered to be degraded if flame or smoke is observed, or if ash deposits are observed on the impact test apparatus when the top cylinder is removed.
  • According to the method applied, if a positive reaction is seen in one of 6 shots (1/6 method) or the energy point where the energetic material reacts positively with a probability of % 50 is reported as the test result.

Friction Sensitivity Test

The friction sensitivity test is performed to determine the sensitivity of energetic materials to friction. The BAM (Bundesanstalt für Materialforschung und -prüfung) method is used for this test. As a result of the test, it is examined whether the material reacts, degrades or bursts. The application procedure of the test is as follows:

  • Any change in the color and odor of the tested material is considered as degradation.
  • A spark, flame, smoke or crackling heard during the test is considered a positive reaction.
  • Depending on the method applied, a positive reaction in one of 6 trials (1/6 method) or the energy point at which the energetic material reacts positively with a probability of % 50 is reported as the test result.

Thermal Conductivity Coefficient Determination Device

This device is capable of determining the thermal conductivity coefficients of polymer, foam or ceramic materials in the temperature range from -70 to +180°C. The sample size must be at least 5 mm thick and 2.5 cm in diameter for the measurement.

UV-VIS Spectrophotometer

The UV-VIS spectrophotometer is an analytical device that provides qualitative and quantitative results operating in the ultraviolet and visible regions. In UV-VIS regions, it determines the content by absorption of light by molecules. A calibration curve is needed for content determination.

Viscosity Device

The kinematic viscosity device measures how fast fluids move under gravity.

Electronic Quality Control Laboratory

The Electronics Quality Control Laboratory is staffed by 3 engineers and 5 technicians. The infrastructure of the laboratory is capable of performing various quality control inspection methods such as quality controls of printed circuit boards, components and soldering workmanship, wiring tests, acrylic coating controls and electrostatic discharge tests before and after typesetting. Below is information about the devices used in these methods and their capacities.

Solder Fill and Component Damage Inspection

After checking the presence/absence of components and the accuracy of directional information, solder fill and component damage are visually inspected according to the Class 3 requirements of the IPC-610 standard. Tools and systems such as table top magnifier, stereo microscope, HD high resolution camera and AOI (Optical Inspection Instrument) are used for visual inspection.

Stereo Microscope

The Electronic Quality Control Infrastructure has 3 different microscope types, with magnification capacities of "40X", "90X" and "200X". The "90X" magnification microscope has the ability to rotate the image 360° around its axis and to view the image at a 360° angle from the top.

AOI (Optical Inspection Instrument)

In order to perform inspection with the AOI device, the schematic of the board must be created using gerber data information and the program must be written. After the schematic information of the board is defined to the device, inspection criteria such as dimensional properties, solder filling, directional information are defined one by one according to the types of electronic components. The defined information and program are saved in the device's database and when the same type of board is inspected, the relevant program can be used to perform the inspection quickly. The inspection capabilities of the AOI device are as follows:

-         Detectable Component Fault Types: It is capable of detecting defect types such as missing, offset, skewed, misaligned, planted, upturned, inverted, incorrect, damaged components.

-         Solder Failure Types: For cream solder, wave solder or hand soldering, it is capable of detecting defect types such as short circuit, capillary short circuit, unsoldered, under or over soldered, partial soldering, improper solder balls.

In order to perform a card inspection with the AOI device, the card must either come with a panel or there must be a distance of at least 5 mm from the edge of the card to the nearest component pad.

Technical Specifications:

  • Sample Size: 508 mm x 508 mm PCB (max)
  • Resolution: "40 fps for 8.3 Fm/pixel resolution in high-resolution mode"
  • 0.5 µm resolution along the Z direction
  • Measurement Method: "Fringe projector for 3D analyses"

Conformal Coating Visual Inspection Principles

Conformal coating is applied to protect the electronic card equipment whose electrical tests have been completed from environmental conditions. During the quality control of the applied conformal coating, the homogeneity of the coating under violet light, air bubbles, fluctuations and the presence or absence of acrylic coating where necessary are checked.

Quality Control Principles of Cabling

Electrical testing and visual inspection of the completed cabling is carried out according to the Class 3 criteria of the IPC-620 standard and the requirements in the relevant source document.

 The following functions can be performed in the electrical test step:

  • Conductivity test
  • Short circuit
  • Insulation
  • HiPot tests

For electrical tests, tests are carried out with a device with 32 port inputs and a voltage of 1,500 VDC.

In order to apply RF testing to antenna cabling, there is a Network analyzer device that can measure between 100 kHz-8 GHz. With this device, features such as VSWR and signal loss are analyzed.

In the visual inspection step, features of the cabling such as connector damage, pin damage, tubing/cable sheath damage, cable exit direction of the connector are checked.

Electrostatic Discharge Test

Electrostatic Discharge (ESB) Device: 330/500/5.000/5.000 MOhm, 2kV-25kV test voltage range. It can be operated with computer or manually with "Air" and "Contact" with positive and negative "discharge" capacity.